Description
| Operating temperature | (-50) to +150°C |
| Density | 2.6g/cm3 |
| Silicone based | Yes |
| Electrically conductive | No |
| Color | Grey |
Details
- Polartherm introduces the X-8, a new thermal paste designed with an
- outstanding price-performance ratio, specifically created for
- mainstream PC users. As a low-viscosity thermal paste, the X-8 is very
- easy to apply since it spreads across the CPU heat spreader through
- the contact pressure of the CPU cooler alone. Although application
- tools are not strictly necessary, they are included with the paste. The
- thermal conductivity of the X-8 is good, making it suitable for gaming
- PCs with processors that have a thermal dissipation power (TDP) of
- up to 70 watts. This covers Intel’s Core i3/i5 and Core Ultra 3/5
- series processors, as well as AMD's Ryzen 3 and 5 series.
- Thermal paste, referred to in English as "Thermal Interface Material"
- (TIM), is a heat-conductive medium. TIMs include materials such as
- thermal paste, thermal pads, and liquid metals, all of which serve to
- dissipate waste heat. In PCs, waste heat is generated wherever
- significant power is consumed: primarily in the CPU (processor) and
- GPU (graphics card). Other components, such as memory and
- SSDs, also benefit from effective cooling. Thermal paste consists of
- a carrier material, such as silicone oil, that contains microscopic
- particles like aluminum oxide or zinc oxide. For instance, the paste is
- applied to the CPU’s heat spreader (IHS) before mounting the CPU
- cooler. The paste fills microscopic gaps between the surfaces of the
- IHS and the cooler, facilitating efficient heat dissipation.
- Despite its low viscosity, Polartherm X-8 is only slightly affected by the
- pump-out effect when used as intended. The pump-out effect occurs
- gradually, as thermal paste is squeezed out from between the heat
- spreader and the CPU cooler’s base plate. This happens because the
- heat spreader and base plate deform under temperature load
- (becoming concave or convex) and return to their original shape
- (flat) when cooled. Different materials, such as silicon and copper,
- have different rates of thermal expansion, which can make the
- pump-out effect particularly pronounced in setups using copper
- coolers on graphics chips.